Heat and moisture resistance is crucial for PCBs. Bakelite® and DuriteTM high purity resins are used for chip encapsulation, as underfill adhesives, and in the impregnation of copper clad laminates (CCL) for printed circuit boards (PCB). These resins provide:
- High temperature stability
- Increased moisture resistance
- Low electrical conductivity
- Better copper adhesion
To meet your specific application
requirements and ease manufacturing,
our technical team will tailor resin attributes, such as:
- Softening point
- Hydroxyl equivalent
- Glass transition temperature
- Molecular weight and
- Viscosity
