Electronics – Phenolic Resins for:

Heat and moisture resistance is crucial for PCBs. Bakelite® and DuriteTM high purity resins are used for chip encapsulation, as underfill adhesives, and in the impregnation of copper clad laminates (CCL) for printed circuit boards (PCB). These resins provide:

  • High temperature stability
  • Increased moisture resistance
  • Low electrical conductivity
  • Better copper adhesion

To meet your specific application
requirements and ease manufacturing,
our technical team will tailor resin attributes, such as:

  • Softening point
  • Hydroxyl equivalent
  • Glass transition temperature
  • Molecular weight and
  • Viscosity